Dynamic analysis of multilayer ceramic capacitor for vibration reduction of printed circuit board

被引：13

作者：

Kim, Dongjoon ^{[1
]}

Kim, Wheejae ^{[1
]}

Kim, Wan-Chin ^{[2
]}

机构：

[1] Yonsei Univ, Sch Mech Engn, Seoul 03722, South Korea

[2] Hanbat Natl Univ, Dept Smart Mfg Appl Engn, Daejeon 34158, South Korea

来源：

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY | 2019年 / 33卷 / 04期

基金：

新加坡国家研究基金会;

关键词：

Printed circuit board vibration; Acoustic noise; Dynamic analysis; Multilayer ceramic capacitor (MLCC); Parametric study;

D O I：

10.1007/s12206-019-0311-4

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Owing to their high permittivity and volumetric efficiency, the demand for multilayer ceramic capacitors (MLCCs) has increased rapidly in recent times. Because of the electromechanical characteristics of BaTiO3, MLCC vibrates, resulting in printed circuit boards (PCBs) generating acoustic noise. To construct an accurate finite element model of an MLCC, piezoelectric and electrostrictive coefficients were extracted and verified through experiments. The top cover layer thickness and bandwidth were chosen as design parameters to reduce the vibration of PCB. The simulation results indicate that the bandwidth and top cover layer thickness are highly related to the vibration in the top direction and the rotational moment generated from the head surface, respectively. Based on the analysis results, a novel MLCC was suggested and it exhibited reduced vibrational characteristics of PCB about 75 % compared with that of commercial MLCCs.

引用

页码：1595 / 1601

页数：7

共 12 条

[11] Control of electromechanical properties of multilayer ceramic capacitors for vibration reduction [J].

Ohm, Won-Suk ;

Kim, Dongjoon ;

Ko, Byung-Han ;

Park, No-Cheol .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2018, 101 (05) :1982-1990

[12] Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration [J].

Wang, Yi-Qi ;

Ko, Byung-Han ;

Jeong, Sang-Geuk ;

Park, Kyoung-Su ;

Park, No-Cheol ;

Park, Young-Pil .

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (12) :2565-2571

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