Characterization of Special Grain Boundaries and Triple Junctions in CuxNi1-x Alloys upon Deformation and Annealing

被引：2

作者：

Emeis, Friederike ^{[1
]}

Leuthold, Joern ^{[1
]}

Spangenberg, Katharina ^{[1
]}

Peterlechner, Martin ^{[1
]}

Wilde, Gerhard ^{[1
]}

机构：

[1] Univ Munster, Inst Mat Phys, Wilhelm Klemm Str 10, D-48149 Munster, Germany

来源：

ADVANCED ENGINEERING MATERIALS | 2019年 / 21卷 / 04期

关键词：

Cu-Ni alloys; electron backscatter-diffraction (EBSD); severe plastic deformation; triple junctions; twinning; CRACK NUCLEATION; FATIGUE; DESIGN; MICROSTRUCTURE; DISTRIBUTIONS; PROPAGATION; EVOLUTION; NETWORKS;

D O I：

10.1002/adem.201801214

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We compare two quantities to describe a microstructure: the length fraction of sigma 3/sigma 9-grain boundaries and the number fraction of sigma 3-x-x/sigma 3-sigma 3-sigma 9-triple junctions using Cu, Ni and four of their alloys in several microstructural states. The fractions of sigma 3-grain boundaries show similar tendencies as the respective fractions of sigma 3-x-x-triple junctions in relation to the grain size upon deformation and annealing. However, the fraction of sigma 9-grain boundaries stagnates at certain grain sizes, while there is still a considerable change of sigma 3-sigma 3-sigma 9-triple junctions during grain growth, meaning that the sigma 3-sigma 3-sigma 9-triple junction microstructure is still evolving. To analyze the evolution of the triple junction microstructure, a program, such as pythorient, is necessary.

引用

页数：6

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