Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder

被引：0

作者：

Wei, Guoqiang ^{[1
]}

Wang, Lei ^{[1
]}

机构：

[1] S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

关键词：

lead-free solder; cooling rate; microstructure; microhardness; SN-AG-CU; BEHAVIOR; JOINTS; ALLOY;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of cooling rate on the microstructure and microhardness of Sn-3.0Ag-0.5Cu solder was studied. The results showed that the undercooling of the solder increases with the cooling rate increasing, resulting in eutectic composition shifting to the hypoeutectic region, thus increasing the volume ratio of the primary beta-Sn and decreasing its grain size, Simultaneously, Ag3Sn in the eutectic region transforms from the large lamellar-like to uniformly distributed fine granular-like. Due to the grain refinement of the primary beta-Sn and dispersion strengthening of the fine Ag3Sn in SAC305 solder, its microhardness markedly increases.

引用

页码：452 / 455

页数：4

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