A new isolation technology for mixed-mode and general mixed-technology SOC chips

被引：3

作者：

Liao, CP ^{[1
]}

Juang, KC ^{[1
]}

Huang, TH ^{[1
]}

Duh, DS ^{[1
]}

Yang, TT ^{[1
]}

Liu, MN ^{[1
]}

机构：

[1] Ind Technol Res Inst, Elect Res & Serv Org, Chutang, Taiwan

来源：

2000 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP | 2000年

关键词：

D O I：

10.1109/SMTW.2000.883093

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

With higher levels of integration in VLSI, the importance of limiting undesirable interactions (i.e., cross-talks) between different circuits fabricated upon a common silicon substrate is increasing. Such interaction, referred to as substrate coupling, is more significant in the mixed-mode (e.g., digital-analog) or mixed-technology integrated circuits, particularly in the high frequency regime.

引用

页码：124 / 132

页数：9

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