Failure mechanism of TFT devices on flexible substrate by cyclic bending test

被引：0

作者：

Hu, Kun ^{[1
]}

Cai, Shixing ^{[1
]}

Lin, Li ^{[1
]}

Gao, Xiaoyu ^{[1
]}

Huang, Xiuqi ^{[1
]}

机构：

[1] Kunshan New Flat Panel Display Technol Ctr Co LTD, Kunshan, Jiangsu, Peoples R China

来源：

2016 7TH INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN FOR THIN-FILM TRANSISTOR TECHNOLOGIES (CAD-TFT) | 2016年

关键词：

TFT; failure mechanism; cyclic bending test;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the failure mechanism of TFT devices on flexible substrate was investigated using bending test. The results show that the TFT fails due to the micro-cracks in M-2 lines; the micro-cracks first generate at the brittle layers and then migrate to the M-2 lines.

引用

页码：5 / 5

页数：1