Design, fabrication, and testing of a 3-DOF HARM micromanipulator on (111) silicon substrate

被引:24
作者
Chang, HC [1 ]
Tsai, JML [1 ]
Tsai, HC [1 ]
Fang, WL [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 300, Taiwan
关键词
micromanipulator; micro robot arm; micro gripper; 3-DOE; (111)wafer;
D O I
10.1016/j.sna.2005.06.013
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, a novel HARM (high aspect ratio micromachining) micromanipulator fabricated on (111) silicon wafer is reported. The micromanipulator consists of a positioning stage, a robot ann, supporting platforms, conducting wires, and bonding pads. These components are monolithically integrated on a chip through the presented processes. The three-degrees-of-freedom (3-DOF) positioning of the micromanipulator is realized by using the integration of two linear comb actuators and a vertical comb actuator. The robot arm is used to manipulate samples with dimension in the order of several microns to several hundred microns, for instance, optical fibers and biological samples. The robot arm could be a gripper, a needle, a probe, or even a pipette. Since the micromanipulator is made of single crystal silicon, it has superior mechanical properties. A micro gripper has also been successfully designed and fabricated. (c) 2005 Published by Elsevier B.V.
引用
收藏
页码:438 / 445
页数:8
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