Modification of Sn-1.0Ag-0.5Cu solder using nickel and boron

被引：8

作者：

Qu, Jun-Feng ^{[1
,2
]}

Xu, Jun ^{[1
,2
]}

Hu, Qiang ^{[1
,2
]}

Zhang, Fu-Wen ^{[1
,2
]}

Zhang, Shao-Ming ^{[1
,2
]}

机构：

[1] Natl Engn Res Ctr Nonferrous Met Composites, Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China

[2] Beijing COMPO Adv Technol Co Ltd, Dept Technol, Beijing 101407, Peoples R China

来源：

RARE METALS | 2015年 / 34卷 / 11期

关键词：

Lead-free solder; Sn-1.0Ag-0.5Cu; Interfacial reaction; B addition; Intermetallic compound; PB-FREE SOLDERS; GRAIN-BOUNDARIES; INTERMETALLIC COMPOUND; INTERFACIAL REACTION; CHEMISTRY; GROWTH; MICROSTRUCTURE; KINETICS; JOINTS; NI3AL;

D O I：

10.1007/s12598-014-0221-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound (IMC) of Sn-1.0Ag-0.5Cu alloys (SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.

引用

页码：783 / 788

页数：6

共 17 条

[1] Influence of Sb on IMC growth in Sn-Ag-Cu-SbPb-free solder joints in reflow process [J].

Chen, BL ;

Li, GY .

THIN SOLID FILMS, 2004, 462 :395-401

[2] EFFECT OF BORON ON THE TENSILE PROPERTIES OF B2 FEAL [J].

CRIMP, MA ;

VEDULA, K .

MATERIALS SCIENCE AND ENGINEERING, 1986, 78 (02) :193-200

[3] Pb-free solders for flip-chip interconnects [J].

Frear, DR ;

Jang, JW ;

Lin, JK ;

Zhang, C .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06) :28-+

[4] EFFECT OF VACUUM ON ROOM-TEMPERATURE DUCTILITY OF NI3AL [J].

GEORGE, EP ;

LIU, CT ;

POPE, DP .

SCRIPTA METALLURGICA ET MATERIALIA, 1994, 30 (01) :37-42

[5] Interfacial reaction issues for lead-free electronic solders [J].

Ho, C. E. ;

Yang, S. C. ;

Kao, C. R. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :155-174

[6] Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders [J].

Kanlayasiri, Kannachai ;

Ariga, Tadashi .

JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 504 (01) :L5-L9

[7] Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate [J].

Kim, DG ;

Jung, SB .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 386 (1-2) :151-156

[8] Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu [J].

Lee, TY ;

Choi, WJ ;

Tu, KN ;

Jang, JW ;

Kuo, SM ;

Lin, JK ;

Frear, DR ;

Zeng, K ;

Kivilahti, JK .

JOURNAL OF MATERIALS RESEARCH, 2002, 17 (02) :291-301

[9] Structure, chemistry and bonding at grain boundaries in Ni3Al .1. The role of boron in ductilizing grain boundaries [J].

Muller, DA ;

Subramanian, S ;

Batson, PE ;

Silcox, J ;

Sass, SL .

ACTA MATERIALIA, 1996, 44 (04) :1637-1645

[10] Microstructure and Growth Behavior of the Intermetallic Compound for Sn-1.0Ag-0.5Cu-NiB/Cu Solder Joint Interface [J].

Qu, Junfeng ;

Xu, Jun ;

Hu, Qiang ;

Zhang, Fuwen .

ADVANCES IN MATERIALS AND MATERIALS PROCESSING, PTS 1-3, 2013, 652-654 :1106-1110

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