Simple modeling of coplanar waveguide on thick dielectric over lossy substrate

被引:29
作者
Ko, JS [1 ]
Kim, BK [1 ]
Lee, K [1 ]
机构
[1] KOREA ADV INST SCI & TECHNOL, DEPT ELECT ENGN, TAEJON 305701, SOUTH KOREA
关键词
D O I
10.1109/16.568049
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a simple semi-empirical high-frequency equivalent circuit model to characterize the coplanar waveguide structure, which consists of relatively thick metal line on very thick polyimide over lossy substrate such as Si BICMOS wafer, Considering the geometric dependence of the conductive loss and the skin effect of the substrate loss, we derive modified models for the equivalent circuit elements, We verify the validity of our model by comparing it with the experimental measurement, Our model is simple enough not only to be suitable for efficient circuit simulation but also to be useful for process characterization and design.
引用
收藏
页码:856 / 861
页数:6
相关论文
共 14 条
[1]  
Burghartz JN, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P1015, DOI 10.1109/IEDM.1995.499389
[2]  
Case M, 1995, PROCEEDINGS: IEEE/CORNELL CONFERENCE ON ADVANCED CONCEPTS IN HIGH SPEED SEMICONDUCTOR DEVICES AND CIRCUITS, P85, DOI 10.1109/CORNEL.1995.482423
[3]   LARGE SUSPENDED INDUCTORS ON SILICON AND THEIR USE IN A 2-MU-M CMOS RF AMPLIFIER [J].
CHANG, JYC ;
ABIDI, AA ;
GAITAN, M .
IEEE ELECTRON DEVICE LETTERS, 1993, 14 (05) :246-248
[4]   FINITE BOUNDARY CORRECTIONS TO COPLANAR WAVEGUIDE ANALYSIS [J].
DAVIS, ME ;
WILLIAMS, EW ;
CELESTINI, AC .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1973, MT21 (09) :594-596
[5]   HIGH-SPEED VLSI INTERCONNECT MODELING BASED ON S-PARAMETER MEASUREMENTS [J].
EO, Y ;
EISENSTADT, WR .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05) :555-562
[6]  
Gupta K C, 1979, MICROSTRIP LINES SLO
[7]   PROPERTIES OF MICROSTRIP LINE ON SI-SIO2 SYSTEM [J].
HASEGAWA, H ;
FURUKAWA, M ;
YANAI, H .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1971, MT19 (11) :869-+
[8]   ANALYSIS OF INTERCONNECTION DELAY ON VERY HIGH-SPEED LSI VLSI CHIPS USING AN MIS MICROSTRIP LINE MODEL [J].
HASEGAWA, H ;
SEKI, S .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1984, 32 (12) :1721-1727
[9]  
Kim BK, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P717, DOI 10.1109/IEDM.1995.499319
[10]  
KWON YR, 1987, IEEE T MICROW THEORY, V35, P545