Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip

被引：37

作者：

Xiang, Dong ^{[1
]}

Chakrabarty, Krishnendu ^{[2
]}

Fujiwara, Hideo ^{[3
]}

机构：

[1] Tsinghua Univ, Sch Software, Beijing 100084, Peoples R China

[2] Duke Univ, Dept Elect & Comp Engn, Durham, NC 27708 USA

[3] Osaka Gakuin Univ, Fac Informat, 2-36-1 Kishibe Minami, Suita, Osaka 5648511, Japan

来源：

IEEE TRANSACTIONS ON COMPUTERS | 2016年 / 65卷 / 09期

基金：

美国国家科学基金会;

关键词：

On-chip networks; NOC core testing; 3D stacked NOCs; thermal-aware test delivery; unicast-based multicast; POWER; COMMUNICATION; ROUTER;

D O I：

10.1109/TC.2015.2493548

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A 3D stacked network-on-chip (NOC) promises the integration of a large number of cores in a many-core system-on-chip (SOC). The NOC can be used to test the embedded cores in such SOCs, whereby the added cost of dedicated test-access hardware can be avoided. However, a potential problem associated with 3D NOC-based test access is the emergence of hotspots due to stacking and the high toggle rates associated with structural test patterns used for manufacturing test. High temperatures and hotspots can lead to the failure of good parts, resulting in yield loss. We describe a unicast-based multicast approach and a thermal-driven test scheduling method to avoid hotspots, whereby the full NOC bandwidth is used to deliver test packets. Test delivery is carried out using a new unicast-based multicast scheme. Experimental results highlight the effectiveness of the proposed method in reducing test time under thermal constraints.

引用

页码：2767 / 2779

页数：13