History and Recent Progress of MEMS Physical Sensors

被引：6
作者：
Muro, Hideo [1 ]
机构：
[1] Chiba Inst Technol, Narashino, Chiba 2750016, Japan
来源：
NEXT GENERATION MICRO/NANO SYSTEMS | 2013年 / 81卷
关键词：
MEMS; physical sensor; micromachining; accelerometer;
D O I：
10.4028/www.scientific.net/AST.81.1
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Recently various electronic control systems for automotive, industrial and consumer-electronic applications have been developed using advanced semiconductor technologies including MEMS sensors. This paper reviews the history of the development of the MEMS physical sensors and highlights their recent progress where their research trends are categorized into the following 4 items: i) Incorporation of heterogeneous sensors,) Integration with advanced CMOS circuitry,iii) Improvement on wafer-level packaging technology, iv) Adoption of new materials. Several examples of each item are introduced in this paper.
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页码：1 / 8
页数：8
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