Manufacturing experience with high performance mixed dielectric circuit boards

被引：4

作者：

Farquhar, DS ^{[1
]}

Seman, AM ^{[1
]}

Poliks, MD ^{[1
]}

机构：

[1] IBM Corp, Microelect, Endicott, NY 13760 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 02期

关键词：

hybrid composites; lamination; mixed dielectric; printed circuit boards; PTFE; RF Microwave; stepped cavities;

D O I：

10.1109/6040.763186

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A wide range of advanced dielectric materials are available for use in high speed digital and RF/Microwave printed circuit boards (PCB's), These materials present new challenges in the manufacturing process, especially when they are combined in mixed or unbalanced structures. The properties of these materials are reviewed, and their impact on manufacturing in various product applications is discussed.

引用

页码：153 / 159

页数：7