ACA bonding technology for low cost electronics packaging applications - Current status and remaining challenges

被引：46

作者：

Liu, J ^{[1
]}

机构：

[1] Chalmers Univ Technol, Sch Mech & Vehicular Engn, S-41296 Gothenburg, Sweden

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2001年 / 13卷 / 03期

关键词：

anisotropy; conductive adhesives;

D O I：

10.1108/09540910110407397

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for over a decade on glass substrates, and more recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. Summarises various technologies used in connection with ACA joining. A summary of our understanding of the electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications Is elaborated. Finally, future research areas and remaining issues are pointed out.

引用

页码：39 / 57

页数：19

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