Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

被引：21

作者：

He, Huang ^{[1
]}

Huang, Shangyu ^{[1
]}

Xiao, Yong ^{[1
,2
]}

Goodall, Russell ^{[2
]}

机构：

[1] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China

[2] Univ Sheffield, Dept Mat Sci & Engn, Sheffield S1 3JD, S Yorkshire, England

来源：

MATERIALS LETTERS | 2020年 / 281卷

基金：

英国工程与自然科学研究理事会;

关键词：

Ni foam/Sn composite solder; Cu joint; Microstructure; Solid state reaction; Intermetallic alloys and compounds; INTERMETALLIC COMPOUND;

D O I：

10.1016/j.matlet.2020.128642

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sn based composite solder, reinforced with low porosity Ni-foam, was used to fabricate high melting point Cu interconnects by soldering at 260 degrees C. The effects of soldering time on the microstructure and mechanical properties of the joints were investigated. The Sn matrix was rapidly consumed by the formation of (Cu,Ni)(6)Sn-5 and (Ni,Cu)(3)Sn-4 phases in under 10 min. With increasing soldering time, the (Cu, Ni)(6)Sn-5 phase was largely transformed into the (Ni,Cu)(3)Sn-4 phase, accompanied by the refinement in the size of the phases. The average shear strength of the joint soldered for 60 min was up to 76.9 MPa, which is significantly stronger than commonly reported for Cu joints soldered with Sn based alloys. (C) 2020 Elsevier B.V. All rights reserved.

引用

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