EXPERIMENTAL STUDY ON THERMAL PERFORMANCE OF PULSATING HEAT PIPE WITH Al2O3-DEIONIZED WATER NANOFLUID AT DIFFERENT ORIENTATIONS

被引:7
作者
Verma, B. [1 ]
Yadav, V. L. [1 ]
Srivastava, K. K. [1 ]
机构
[1] IIT BHU, Dept Chem Engn, Varanasi 221005, Uttar Pradesh, India
关键词
pulsating heat pipe; start-up; thermal resistance; nanofluid; working fluid; heat transfer coefficient; TRANSPORT CAPABILITY; FLUID;
D O I
10.1615/JEnhHeatTransf.2013006540
中图分类号
O414.1 [热力学];
学科分类号
摘要
Thermal resistance as a function of heat load and start-up temperature with respect to time have been investigated for a pulsating heat pipe (PHP) at different inclination angles. PHP was made of 1.45 mm inner diameter copper tubes having 6 turns. Al2O3 nanofluid (concentration 0.25%, 0.5, 1.0, 1.25, 1.5, and 2.5% by wt.) with particle size 45 nm at an optimum filling ratio of 50% was used. It is found that as the concentration increases from 0.25% to 1.0% there is considerable decrease in thermal resistance as compared to that of the base fluid but as the concentration increases from 1.25% to 2.5% the thermal performance deteriorates. Optimum concentration of nanoparticles was 1.0% by wt. in base fluid with respect to start-up and thermal resistance for PHP in vertical orientation and 45 degrees inclination, while in horizontal orientation 0.5% by wt. concentration showed the best results. Maximum decrease in thermal resistance with respect to deionized (DI) water was observed at 50 W for 1.0% nanofluid concentration by wt. at 45 degrees inclination, which was 33.6%. Heat transfer coefficients at evaporator and condenser are also investigated at vertical mode of operation.
引用
收藏
页码:153 / 163
页数:11
相关论文
共 23 条
[21]   Heat transfer rate of a closed-loop oscillating heat pipe with check valves using silver nanofluid as working fluid [J].
Wannapakhe, S. ;
Rittidech, S. ;
Bubphachot, B. ;
Watanabe, O. .
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2009, 23 (06) :1576-1582
[22]   Advances and unsolved issues in pulsating heat pipes [J].
Zhang, Yuwen ;
Faghri, Amir .
HEAT TRANSFER ENGINEERING, 2008, 29 (01) :20-44
[23]   Analysis of microchannel heat sinks, for electronics cooling [J].
Zhao, CY ;
Lu, TJ .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2002, 45 (24) :4857-4869