Effects of Cu on the precipitation of intermetallic compounds and the intergranular corrosion of hyper duplex stainless steels

被引：38

作者：

Jeon, Soon-Hyeok ^{[1
]}

Kim, Soon-Tae ^{[1
]}

Lee, In-Sung ^{[1
]}

Kim, Ji-Soo ^{[2
]}

Kim, Kwang-Tae ^{[2
]}

Park, Yong-Soo ^{[1
]}

机构：

[1] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea

[2] POSCO Tech Res Labs, Stainless Steel Res Grp, Pohang 790785, Gyeongbuk, South Korea

来源：

CORROSION SCIENCE | 2013年 / 66卷

关键词：

Copper; Stainless; Polarization; SEM; Intergranular corrosion; SIGMA-PHASE FORMATION; MECHANICAL-PROPERTIES; LOCALIZED CORROSION; BEHAVIOR; TEMPERATURE; KINETICS; MO;

D O I：

10.1016/j.corsci.2012.09.023

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

To elucidate the effects of Cu on the precipitation of intermetallic compounds and the intergranular corrosion of the hyper duplex stainless steels, a double loop potentiokinetic reactivation test, a scanning electron microscope analysis and thermodynamic calculation were conducted. The addition of Cu to the base alloy reduces the total amount of intermetallic compounds. Particularly, Cu addition to the base alloy results in pronouncedly suppressing the amount of sigma phase whereas it slightly increases chi phases. The Cu added alloy reduces the degree of sensitization due to the delayed precipitation of intermetallic compounds, compared with that of the base alloy. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：217 / 224

页数：8

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