In situ observations of crack arrest and bridging by nanoscale twins in copper thin films

被引:84
作者
Kim, Seong-Woong [1 ]
Li, Xiaoyan [1 ]
Gao, Huajian [1 ]
Kumar, Sharvan [1 ]
机构
[1] Brown Univ, Sch Engn, Providence, RI 02912 USA
关键词
In situ transmission electron microscopy; Molecular dynamics; Nanoscale twins; Crack bridging; Dislocations; STRAIN-RATE SENSITIVITY; ULTRAHIGH-STRENGTH; MAXIMUM STRENGTH; GRAIN-BOUNDARY; FRACTURE; DEFORMATION; MECHANISMS; DUCTILITY; TENSILE;
D O I
10.1016/j.actamat.2012.02.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In situ tensile experiments in a transmission electron microscope revealed that micro-cracks in ultrafine grained, free-standing, thin copper foils containing nanoscale twins initiated in matrix domains separated by the twins and then arrested at twin boundaries as twin boundary sliding proceeded. The adjacent microcracks eventually coalesced through shear failure of the bridging twins. To investigate the atomic mechanism of this rarely seen nanoscale crack bridging behavior, molecular dynamics simulations were performed to show that during crack propagation twin boundaries are impinged upon by numerous dislocations from the plastically deforming matrix. These dislocations react at the interface and evolve into substantially impenetrable dislocation walls that strongly confine crack nucleation and resist crack propagation, leading to the experimentally observed crack bridging behavior. The present results raise an approach to significantly toughening polycrystalline thin films by incorporating nanoscale twin structures into individual grains that serve as crack bridging ligaments. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:2959 / 2972
页数:14
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