Status of GaN-based Power Switching Devices

被引:0
|
作者
Hikita, Masahiro [1 ]
Ueno, Hiroaki [1 ]
Matsuo, Hisayoshi [1 ]
Ueda, Tetsuzo [1 ]
Uemoto, Yasuhiro [1 ]
Inoue, Kaoru [1 ]
Tanaka, Tsuyoshi [1 ]
Ueda, Daisuke [1 ]
机构
[1] Matsushita Elect Panason, Semicond Co, Semicond Device Res Ctr, Nagaokakyo, Kyoto 6178520, Japan
关键词
GaN; Si substrate; normally-off; hole injection; conductivity modulation; high power switching; ENHANCEMENT; HFET; HEMT;
D O I
10.4028/www.scientific.net/MSF.600-603.1257
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
State-of-the-art technologies of GaN-based power switching transistors are reviewed, in which normally-off operation and heat spreading as technical issues. We demonstrate a new operation principle of GaN-based normally-off transistor called Gate Injection Transistor (GIT). The GIT utilizes hole-injection from p-AlGaN to AlGaN/GaN hetero-junction which increases electron density in the depleted channel resulting in dramatic increase of the drain current owing to conductivity modulation. The fabricated GIT on Si substrate exhibits the threshold voltage of +1.0V with high maximum drain current of 200mA/mm. The obtained on-state resistance (R-on.A) and off-state breakdown voltage (BVds) are 2.6m Q . cm(2) and 800V, respectively. These values are the best ones ever reported for GaN-based normally-off transistors. In addition, we propose the use of poly-AlN as surface passivation. The AlN has at least 200 times higher thermal conductivity than conventional SiN so that it can effectively reduce the channel temperature.
引用
收藏
页码:1257 / 1262
页数:6
相关论文
共 50 条
  • [21] GaN-based devices on Si
    Krost, A.
    Dadgar, A.
    Physica Status Solidi (A) Applied Research, 2002, 194 (2 SPEC.): : 361 - 375
  • [22] Recent Advances and Future Prospects on GaN-based Power Devices
    Ueda, Tetsuzo
    2014 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-HIROSHIMA 2014 - ECCE-ASIA), 2014, : 2075 - 2078
  • [23] A Novel Isolation Approach for GaN-Based Power Integrated Devices
    Zaidan, Zahraa
    Al Taradeh, Nedal
    Benjelloun, Mohammed
    Rodriguez, Christophe
    Soltani, Ali
    Tasselli, Josiane
    Isoird, Karine
    Phung, Luong Viet
    Sonneville, Camille
    Planson, Dominique
    Cordier, Yvon
    Morancho, Frederic
    Maher, Hassan
    MICROMACHINES, 2024, 15 (10)
  • [24] SiC- and GaN-based power devices: technologies, products and applications
    Coffa, S.
    Saggio, M.
    Patti, A.
    2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,
  • [25] Current instabilities in GaN-based devices
    Daumiller, I
    Theron, D
    Gaquière, C
    Vescan, A
    Dietrich, R
    Wieszt, A
    Leier, H
    Vetury, R
    Mishra, UK
    Smorchkova, IP
    Keller, S
    Nguyen, NX
    Nguyen, C
    Kohn, E
    IEEE ELECTRON DEVICE LETTERS, 2001, 22 (02) : 62 - 64
  • [26] Reliability of GaN-Based HEMT Devices
    Menozzi, Roberto
    COMMAD: 2008 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2008, : 44 - 50
  • [27] Application progress of diamond heat dissipation substrate in GaN-based power devices
    Jia, Xin
    Wei, Jun-Jun
    Huang, Ya-Bo
    Shao, Si-Wu
    Kong, Yue-Chan
    Liu, Jin-Long
    Chen, Liang-xian
    Li, Cheng-Ming
    Ye, Hai-Tao
    Surface Technology, 2020, 49 (11) : 111 - 123
  • [28] Engineered linearity of GaN-based HEMTs power devices by tailoring transfer characteristics
    Bahat-Treidel, Eldad
    Khalil, Ibrahim
    Hilt, Oliver
    Wuerfl, Joachim
    Traenkle, Guenther
    PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 6, NO 6, 2009, 6 (06): : 1378 - 1381
  • [29] Generation-recombination noise in GaN and GaN-based devices
    Pala, N
    Rumyantsev, SL
    Shur, MS
    Levinshtein, ME
    Khan, MA
    Simin, G
    Gaska, R
    NOISE IN DEVICES AND CIRCUITS, 2003, 5113 : 217 - 231
  • [30] Progress in GaN-based materials and optical devices
    Melngailis, I
    ADVANCED OPTICAL DEVICES, TECHNOLOGIES, AND MEDICAL APPLICATIONS, 2002, 5123 : 231 - 237