Status of GaN-based Power Switching Devices

被引:0
|
作者
Hikita, Masahiro [1 ]
Ueno, Hiroaki [1 ]
Matsuo, Hisayoshi [1 ]
Ueda, Tetsuzo [1 ]
Uemoto, Yasuhiro [1 ]
Inoue, Kaoru [1 ]
Tanaka, Tsuyoshi [1 ]
Ueda, Daisuke [1 ]
机构
[1] Matsushita Elect Panason, Semicond Co, Semicond Device Res Ctr, Nagaokakyo, Kyoto 6178520, Japan
来源
SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2 | 2009年 / 600-603卷
关键词
GaN; Si substrate; normally-off; hole injection; conductivity modulation; high power switching; ENHANCEMENT; HFET; HEMT;
D O I
10.4028/www.scientific.net/MSF.600-603.1257
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
State-of-the-art technologies of GaN-based power switching transistors are reviewed, in which normally-off operation and heat spreading as technical issues. We demonstrate a new operation principle of GaN-based normally-off transistor called Gate Injection Transistor (GIT). The GIT utilizes hole-injection from p-AlGaN to AlGaN/GaN hetero-junction which increases electron density in the depleted channel resulting in dramatic increase of the drain current owing to conductivity modulation. The fabricated GIT on Si substrate exhibits the threshold voltage of +1.0V with high maximum drain current of 200mA/mm. The obtained on-state resistance (R-on.A) and off-state breakdown voltage (BVds) are 2.6m Q . cm(2) and 800V, respectively. These values are the best ones ever reported for GaN-based normally-off transistors. In addition, we propose the use of poly-AlN as surface passivation. The AlN has at least 200 times higher thermal conductivity than conventional SiN so that it can effectively reduce the channel temperature.
引用
收藏
页码:1257 / 1262
页数:6
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