Taguchi Method Optimization for PCB Lamination Process

被引：0

作者：

Tu, Kuo-Yang ^{[1
]}

Li, Min-Hui ^{[1
]}

机构：

[1] Natl Kaohsiung First Univ Sci & Technol, Inst Syst Informat & Control, Kaohsiung, Taiwan

来源：

NEXT WAVE IN ROBOTICS | 2011年 / 212卷

关键词：

Dry Film; Lamination Process; Taguchi Method; S/N;

D O I：

暂无

中图分类号：

TP24 [机器人技术];

学科分类号：

080202 ; 1405 ;

摘要：

The lamination process of Printed Circuit Board (PCB) is a complex engineering system. Because there are many factors and uncertainties in the process system, it's hard for the optimization of successful lamination ratio. In this paper, the Taguchi method for lamination process optimization is proposed. Based on fundamental analysis, the major factors including board temperature, lamination temperature, lamination press, and lamination time are figured out. From the scale level of the major factors, orthogonal arrays L18 are engaged for the Taguchi experiments. Based on the orthogonal arrays L18 of the Taguchi experiments, the best successful ratio is analyzed to select the level of major factors. The selected level does again Taguchi experiment to improve the successful ratio. Experiment results show that the successful ratio improves very well.

引用

页码：178 / 185

页数：8

共 8 条

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