Influence of silver on structural, electrical, mechanical and soldering properties of tin-indium based alloys

被引：8

作者：

El-Bediwi, AB ^{[1
]}

El-Behay, MM

机构：

[1] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt

[2] Al Azhar Univ, Fac Sci, Dept Phys, Girls Branch, Cairo, Egypt

来源：

RADIATION EFFECTS AND DEFECTS IN SOLIDS | 2004年 / 159卷 / 02期

关键词：

electrical; elastic modulus; lead-free solder; wettability; melting point;

D O I：

10.1080/10420150410001670288

中图分类号：

TL [原子能技术]; O571 [原子核物理学];

学科分类号：

0827 ; 082701 ;

摘要：

Structure, electrical resistivity, wettability, melting point, internal friction and elastic moduli of the Sn50In50, Sn77.2In20Ag2.8, Sn72.5In25Ag2.5 and Sn95Ag5 rapidly solidified lead-free solder alloys have been investigated. The Sn50In50 alloy has better properties such as low strength, melting point, electrical resistivity and adequate wetting for low-temperature solder applications (precious metals) and bearing solder when soldering to gold substrate. In addition, it has better rework/repair characteristics. The electrical resistivity, internal friction and wetting values decrease by adding silver to tin-indium alloys but the melting temperature and elastic modulus values are increased. The Sn95Ag5 lead-free solder alloy has better properties, such as higher values of melting point and elastic modulus as compared with lead-tin eutectic solder alloy, for high-temperature solder applications.

引用

页码：133 / 140

页数：8

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