Thermal conductivity epoxy resin composites filled with boron nitride

被引：267

作者：

Gu, Junwei

Zhang, Qiuyu ^{[1
]}

Dang, Jing

Xie, Chao ^{[2
]}

机构：

[1] Northwestern Polytech Univ, Dept Appl Chem, Key Lab Space Appl Phys & Chem, Minist Educ,Sch Sci, Xian 710072, Peoples R China

[2] Fourth Mil Med Univ, Dept Oral Implantol, Sch Stomatol, Xian 710032, Peoples R China

来源：

POLYMERS FOR ADVANCED TECHNOLOGIES | 2012年 / 23卷 / 06期

关键词：

epoxy resin; boron nitride; thermal conductivity; CARBON NANOTUBE COMPOSITES; MECHANICAL-PROPERTIES; POLYETHYLENE COMPOSITES;

D O I：

10.1002/pat.2063

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Boron nitride (BN) micro particles modified by silane coupling agent, ?-aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052?W/mK, five times higher than that of native EP (0.202?W/mK). The mechanical properties of the composites are optimal with 10?wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright (C) 2011 John Wiley & Sons, Ltd.

引用

页码：1025 / 1028

页数：4

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