共 50 条
- [1] Thermomigration Versus Electromigration in Microelectronics Solder Joints [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (03): : 627 - 635
- [2] [Anonymous], 1960, The Nature of the Chemical Bond, 3rd ed
- [3] [Anonymous], 2010, INT TECHNOLOGY ROADM
- [4] Bari G.A., 2010, Modern electroplating, V5th
- [8] Butrymowicz D. B., 1973, Journal of Physical and Chemical Reference Data, V2, P643, DOI 10.1063/1.3253129
- [9] Copper/carbon nanotube composite interconnect for enhanced electromigration resistance [J]. 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 412 - +