Modeling and Simulation of IC and Package Power/Ground Network

被引：0

作者：

Park, Hyunjeong ^{[1
]}

Gam, Dong Gun ^{[1
]}

Kim, Joungho ^{[1
]}

Kim, Hyungsoo ^{[2
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Elect Engn & Comp Sci, Taejon 305701, South Korea

[2] Hynix Semicond Inc, Memory Res & Dev Div, Cheongjoo, South Korea

来源：

2006 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, PROCEEDINGS | 2006年

关键词：

modeling; simulation; power/ground network; high frequency; IC and package;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The modeling and simulation results about the IC and package power/ground network have been depicted. With the modeling for broadband frequency region, the effect of each part in power/ground network on IC and package was analyzed in frequency domain.

引用

页码：696 / 701

页数：6

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