Developing the procedure of modifying the denture soft liner by silver nanoparticles

被引:0
作者
Chladek, Grzegorz [1 ]
Barszczewska-Rybarek, Izabela [2 ]
Lukaszczyk, Jan [2 ]
机构
[1] Silesian Tech Univ, Fac Mat Engn & Met, Dept Mat Technol, PL-40019 Katowice, Poland
[2] Silesian Tech Univ, Dept Phys Chem & Technol Polymers, Gliwice, Poland
关键词
silver nanoparticles; dental materials; soft liner; modification; antimicrobial effectiveness; CANDIDA-ALBICANS; LINING MATERIALS; IN-VITRO; SERUM PELLICLES; GROWTH; RESIN; COLONIZATION; SALIVARY; FILLER;
D O I
暂无
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
Colonization of denture soft lining materials by fungi and denture plaque leads to infections of mucosa. Microorganisms such as Candida albicans colonize not only the surface of the soft liners, but they also penetrate inside those materials. Therefore the use of common disinfectants, e.g., surface active cleaners, is not a perfect solution for keeping a proper hygiene of soft linings. Modifying soft lining by silver nanoparticles (AgNP) seems to be a right way to overcome those problems. The procedure of modifying two-component silicone material by silver nanoparticles (AgNP) is presented in the article. The solubility tests for both material components have been carried out in the first stage of examinations. On the basis of test results, a solvent has been selected, being a dispersion medium for AgNPs and both soft liner components. The effective method for evaporating a solvent from the composition has been developed. Material components with various AgNP concentrations (10, 20, 40, 80, 120 and 200 ppm) have been obtained. Cured samples of the composites have been examined by SEM to confirm the effectiveness of the procedure.
引用
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页码:23 / 29
页数:7
相关论文
共 23 条
  • [21] Antibacterial activity of silver ions implanted in SiO2 filler on oral streptococci
    Yamamoto, K
    Ohashi, S
    Aono, M
    Kokubo, T
    Yamada, I
    Yamauchi, J
    [J]. DENTAL MATERIALS, 1996, 12 (04) : 227 - 229
  • [22] Yoshida K, 1999, J BIOMED MATER RES, V47, P516, DOI 10.1002/(SICI)1097-4636(19991215)47:4<516::AID-JBM7>3.0.CO
  • [23] 2-E