A Low Cost Patternable Packaging Technology for Biosensors

被引：0

作者：

Buchoux, Anthony ^{[1
]}

Blair, Ewen O. ^{[1
]}

Tsiamis, Andreas ^{[1
]}

Marland, Jamie R. K. ^{[1
]}

Smith, Stewart ^{[1
]}

机构：

[1] Univ Edinburgh, Sch Engn, SMC, Alexander Crum Brown Rd, Edinburgh EH9 3FF, Midlothian, Scotland

来源：

2017 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP 2017) | 2017年

基金：

英国工程与自然科学研究理事会;

关键词：

Biosensors; packaging; electrochemistry; PLATFORMS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 mu m can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 mu m channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

引用

页数：6

共 14 条

[1]

Blair E O, IEEE 2017 INT C MICR

[2] PHOTOCURABLE POLYMERS APPLIED AS ENCAPSULATING MATERIALS FOR ISFET PRODUCTION [J].