共 50 条
- [21] Crystal texture and electromigration damage in Al-based interconnect lines studied by ACOM with the SEM TEXTURE AND ANISOTROPY OF POLYCRYSTALS, 1998, 273-2 : 573 - 577
- [24] Temperature dependence of dominant hillock phases during electromigration of eutectic SnPb solder lines ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, 2007, 124-126 : 9 - +
- [25] Effect of Strain and Strain Rate on the Evolution of Dispersoid Particles in Al-Mn-Fe-Si Alloy During Hot Deformation LIGHT METALS TECHNOLOGY 2013, 2013, 765 : 398 - +
- [26] Microstructure evolution of Mg-Al-Zn alloys during compression test at low strain and temperature MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 527 (1-2): : 370 - 375
- [28] A phase field model for electromigration-induced surface evolution Metals and Materials International, 2003, 9 : 279 - 286
- [29] A phase field model for electromigration-induced surface evolution METALS AND MATERIALS INTERNATIONAL, 2003, 9 (03): : 279 - 286
- [30] Electromigration studies on Sn(Cu) alloy lines Journal of Electronic Materials, 2003, 32 : 1515 - 1522