Modeling of peritectic coupled growth in Cu-Sn alloys

被引:23
作者
Valloton, J. [1 ]
Dantzig, J. A. [1 ,2 ]
Plapp, M. [3 ]
Rappaz, M. [1 ]
机构
[1] Ecole Polytech Fed Lausanne, Inst Mat, Computat Mat Lab, CH-1015 Lausanne, Switzerland
[2] Univ Illinois, Urbana, IL 61801 USA
[3] Ecole Polytech, CNRS, F-91128 Palaiseau, France
基金
瑞士国家科学基金会;
关键词
Peritectic solidification; Directional solidification; Phase field; Copper alloys; Coupled growth; LAMELLAR EUTECTIC GROWTH; DIRECTIONAL-SOLIDIFICATION; MICROSTRUCTURE SELECTION; LOW-SPEED; THIN SAMPLES; SYSTEMS; COMPETITION; PHASE;
D O I
10.1016/j.actamat.2013.05.011
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In directional solidification experiments on hypoperitectic Cu-Sn alloys at low velocity and high thermal gradient, both lamellar and fibrous coupled peritectic growth patterns have been observed. Two phenomena that had not been observed in previous experiments on other alloy systems are investigated here with the help of different modeling approaches. The mean volume fraction of primary phase alpha,(g) over bar (alpha), as determined by X-ray microtomography, decreases with solidification distance over the entire length of the coupled zone, but is always much larger than that expected from the equilibrium phase diagram. Moreover, oscillations in (g) over bar (alpha), with a spatial periodicity approximately equal to the lamellar spacing are also observed. The first observation is explained semi-quantitatively by a simple ID diffusion model, which reveals that the onset of coupled growth occurs during the initial transient of the primary phase planar front growth. A two-dimensional phase-field model is used to monitor the subsequent microstructure evolution, and shows that the lamellar structure exhibits collective 1-lambda oscillations. In agreement with previous studies, it was found that these oscillations lead to stable coupled growth only for a limited range of the control parameters. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:5549 / 5560
页数:12
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