Anodizing method yielding multiple porous seed layers for the epitaxial growth of monocrystalline Si films

被引:2
作者
Rostan, PJ [1 ]
Berge, C [1 ]
Rau, U [1 ]
Werner, JH [1 ]
机构
[1] Univ Stuttgart, Inst Phys Elect, D-70569 Stuttgart, Germany
关键词
D O I
10.1149/1.2158569
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This paper reports on recent improvements in the fabrication of 5 to 15-mu m-thick self-standing porous Si seed films for monocrystalline epitaxy. A multiple three-step anodizing method allows us to separate multiple self-standing porous films from a single 4-in. Si wafer with only one mounting step. So far, we have separated up to three self-standing porous films with diameters of 85 mm (limited by our etch setup) with one continuous anodizing process. The porous films are used as seeding layers for monocrystalline Si epitaxy. Solar cells fabricated from 38-mu m-thick monocrystalline silicon films show independently confirmed efficiencies up to 13.6%. (c) 2006 The Electrochemical Society.
引用
收藏
页码:C133 / C136
页数:4
相关论文
共 13 条
[1]  
[Anonymous], MAT RES SOC S P E
[2]  
BASORE PA, 1993, IEEE PHOT SPEC CONF, P147, DOI 10.1109/PVSC.1993.347063
[3]   AN EXPERIMENTAL AND THEORETICAL-STUDY OF THE FORMATION AND MICROSTRUCTURE OF POROUS SILICON [J].
BEALE, MIJ ;
BENJAMIN, JD ;
UREN, MJ ;
CHEW, NG ;
CULLIS, AG .
JOURNAL OF CRYSTAL GROWTH, 1985, 73 (03) :622-636
[4]  
Bergmann RB, 1999, INT J PHOTOENERGY, V1
[5]   22.8-PERCENT EFFICIENT SILICON SOLAR-CELL [J].
BLAKERS, AW ;
WANG, A ;
MILNE, AM ;
ZHAO, JH ;
GREEN, MA .
APPLIED PHYSICS LETTERS, 1989, 55 (13) :1363-1365
[6]  
BRENDEL R, 1995, P 13 EUR PHOT SOL EN, P432
[7]  
HURRLE A, 2004, P 19 EUR PHOT SOL EN, P459
[8]  
Reber S, 2003, WORL CON PHOTOVOLT E, P1368
[9]   Quasi-monocrystalline silicon for thin-film devices [J].
Rinke, TJ ;
Bergmann, RB ;
Werner, JH .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1999, 68 (06) :705-707
[10]   Optical absorption in crystalline Si films containing spherical voids for internal light scattering [J].
Seel, H ;
Brendel, R .
THIN SOLID FILMS, 2004, 451 :608-611