In-plane flexible solid-state microsupercapacitors for on-chip electronics

被引:28
作者
Zhang, Xingyan [1 ]
Zhao, Wen [1 ]
Wei, Lu [1 ]
Jin, Yiyi [1 ]
Hou, Jie [1 ]
Wang, Xiaoxue [1 ]
Guo, Xin [1 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, Wuhan 430074, Hubei, Peoples R China
基金
中国国家自然科学基金;
关键词
Microsupercapacitor; Interdigital electrodes; Screen printing; Activated carbon nanospheres; Molybdenum oxide nanorods; RIDE-THROUGH CAPABILITY; ENERGY-STORAGE; MICRO-SUPERCAPACITORS; RUTHENIUM OXIDE; CARBON-FILMS; FABRICATION; ARRAYS;
D O I
10.1016/j.energy.2018.12.184
中图分类号
O414.1 [热力学];
学科分类号
摘要
Small-scale supercapacitors or microsupercapacitors (MSCs) can be integrated with miniaturized electronics to work as stand-alone power sources, or as efficient energy storage units coupling with energy harvesters to realize self-powered microdevices. Despite many advances, research and development of MSCs are still in their infancy. In this work, in-plane flexible solid-state MSCs based on interdigital electrodes are developed through a facile, cost-effective, universal and industrially applicable protocol, i.e. screen printing technique. To verify the generality of such method, activated carbon (AC) nanospheres and molybdenum oxide (MoO3-x) nanorods as representative electrical double-layer capacitive material and intercalation pseudocapacitive material are used as the electrode active material, respectively. Using a highly viscous AC nanosphere or MoO3-x nanorod paste, shape-designable microelectrodes with an effective area of 0.415 cm(2), and a spacing of 250 mu m between the two electrode fingers are printed on flexible substrate in several seconds. The MSCs can deliver high areal capacitances and energy densities (5.04 mF cm(-2) and 0.7 mu Wh cm(-2) for the MSC with AC nanosphere electrodes, 41.7 mF cm(-2) and 5.8 mu Wh cm(-2) for the MSC with MoO3-x nanorod electrodes), own excellent rate capability and long cycle life for both the electric double-layer capacitive material and pseudocapacitive material. This work demonstrates the opportunity and practicability for developing MSCs for flexible on-chip electronic devices. (C) 2018 Elsevier Ltd. All rights reserved.
引用
收藏
页码:338 / 348
页数:11
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