Fabrication of an hermetically packaged silicon resonator on LTCC substrate

被引：28

作者：

Nguyen Van Toan ^{[1
,2
]}

Miyashita, Hidetoshi ^{[2
]}

Toda, Masaya ^{[1
,2
]}

Kawai, Yusuke ^{[1
]}

Ono, Takahito ^{[1
]}

机构：

[1] Tohoku Univ, Grad Sch Engn, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, Microsyst Integrat Ctr MSIC, Sendai, Miyagi 9808579, Japan

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2013年 / 19卷 / 08期

关键词：

MEMS;

D O I：

10.1007/s00542-012-1716-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The design, fabrication and packaging process of silicon resonators capable of the integration of LSI (Large Scale Integration) have been developed on the basis of packaging technology using an LTCC (Low Temperature Co-fired Ceramic) substrate. The structures of silicon resonators are defined by deep reactive ion etching (DRIE) on a silicon on insulator (SOI) wafer and then transferred onto the LTCC substrate and hermetically sealed by anodic bonding technique. The measured resonant frequency of a micromechanical bulk acoustic mode silicon resonator after packaging at 0.02 Pa is 20.24 MHz with a quality factor of 50,600.

引用

页码：1165 / 1175

页数：11

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