Temperature Effect on DC and Equivalent Circuit Parameters of 0.15-μm Gate Length GaN/SiC HEMT for Microwave Applications

被引:59
作者
Alim, Mohammad Abdul [1 ]
Rezazadeh, Ali A. [2 ]
Gaquiere, Christophe [3 ]
机构
[1] Univ Chittagong, Dept Appl Phys Elect & Commun Engn, Chittagong 4331, Bangladesh
[2] Univ Manchester, Sch Elect & Elect Engn, Manchester M13 9PL, Lancs, England
[3] Univ Sci & Technol Lille, Dept Microwave & Semicond, F-59650 Villeneuve Dascq, France
关键词
AlGaN/GaN/SiC high-electron-mobility transistor (HEMT); dc and small signal circuit parameters; on-wafer measurements; thermal effect; ALGAN/GAN HEMTS; CHANNEL TEMPERATURE; THERMAL-RESISTANCE; GAN DEVICES; DEPENDENCE; FREQUENCY; SUBSTRATE;
D O I
10.1109/TMTT.2016.2604815
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal characterizations and modeling have been carried out on a 0.15 mu m x (4 x 50) nu m gate GaN-/SiC-based high-electron-mobility transistor varying the temperature from -40 degrees C to 150 degrees C and the frequency up to 50 GHz using on-wafer measurements. The thermal behavior of the dc parameters along with thermal resistance estimation and the equivalent circuit parameters along with cutoff and maximum frequencies were analyzed and reported using a single device. The temperature coefficients of these parameters were presented and deduced the influence of thermal effects on device parameters. These results are important for the circuit designer for future advancement and design optimizations of GaN-based monolithic microwave ICs.
引用
收藏
页码:3483 / 3491
页数:9
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