Use of double-channel heterostructures to improve the access resistance and linearity in GaN-based HEMTs

被引:80
作者
Palacios, T [1 ]
Chini, A [1 ]
Buttari, D [1 ]
Heikman, S [1 ]
Chakraborty, A [1 ]
Keller, S [1 ]
DenBaars, SP [1 ]
Mishra, UK [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
current gain cutoff frequency; gallium nitride (GaN); high-electron mobility transistor (HEMT); high-frequency performance; transconductance; two-tone linearity;
D O I
10.1109/TED.2005.863767
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Double-channel structures have been used in AlGaN/GaN high electron mobility transistors to reduce the access resistance. Carrier densities as high as 2.9 X 10(13) cm(-2) and mobilities in the 1300 cm(2)/V. S range have been obtained in the access region. Also, the correct design of the potential barrier between the different channels allowed tailoring the differential access resistance to enhance the linearity of the transistors. This increase in linearity has been measured as a flatter profile of the transconductance and cutoff frequency versus current and as an improvement of more than 2 dB in large-signal two-tone linearity measurements.
引用
收藏
页码:562 / 565
页数:4
相关论文
共 15 条
[1]   Origin of etch delay time in Cl2 dry etching of AlGaN/GaN structures [J].
Buttari, D ;
Chini, A ;
Palacios, T ;
Coffie, R ;
Shen, L ;
Xing, H ;
Heikman, S ;
McCarthy, L ;
Chakraborty, A ;
Keller, S ;
Mishra, UK .
APPLIED PHYSICS LETTERS, 2003, 83 (23) :4779-4781
[2]   Power and linearity characteristics of field-plated recessed-gate AlGaN-GaNHEMTs [J].
Chini, A ;
Buttari, D ;
Coffie, R ;
Heikman, S ;
Chakraborty, A ;
Keller, S ;
Mishra, UK .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (05) :229-231
[3]   2.1 A/mm current density AlGaN/GaN HEMT [J].
Chini, A ;
Coffie, R ;
Meneghesso, G ;
Zanoni, E ;
Buttari, D ;
Heikman, S ;
Keller, S ;
Mishra, UK .
ELECTRONICS LETTERS, 2003, 39 (07) :625-626
[5]   High conductivity modulation doped AlGaN/GaN multiple channel heterostructures [J].
Heikman, S ;
Keller, S ;
Green, DS ;
DenBaars, SP ;
Mishra, UK .
JOURNAL OF APPLIED PHYSICS, 2003, 94 (08) :5321-5325
[6]   AlGaN/GaN MIS HFETs with fT of 163 GHz using Cat-CVD SiN gate-insulating and passivation layers [J].
Higashiwaki, M ;
Matsui, T ;
Mimura, T .
IEEE ELECTRON DEVICE LETTERS, 2006, 27 (01) :16-18
[7]  
Inoue T, 2003, IEICE T ELECTRON, VE86C, P2065
[8]   PARASITIC SOURCE AND DRAIN RESISTANCE IN HIGH-ELECTRON-MOBILITY TRANSISTORS [J].
LEE, SJ ;
CROWELL, CR .
SOLID-STATE ELECTRONICS, 1985, 28 (07) :659-668
[9]   Source resistance reduction of AlGaN-GaNHFETs with novel superlattice cap layer [J].
Murata, T ;
Hikita, M ;
Hirose, Y ;
Uemoto, Y ;
Inoue, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2005, 52 (06) :1042-1047
[10]  
NAWAZ M, 1995, P 4 INT C SOL STAT I, P512