Analytical Model for Optimum Signal Integrity in PCB Interconnects Using Ground Tracks

被引：10

作者：

Sharma, Rohit ^{[1
]}

Chakravarty, Tapas ^{[2
]}

Bhattacharyya, Amalendu Bhushan ^{[3
]}

机构：

[1] Jaypee Univ Informat Technol, Solan 173215, India

[2] Tata Consultancy Serv, Bangalore 560067, Karnataka, India

[3] Informat Technol Univ, Jaypee Inst, Noida 201307, India

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2009年 / 51卷 / 01期

关键词：

Crosstalk; finite-difference time-domain (FDTD); ground tracks; printed circuit board (PCB) interconnects; signal integrity; variational analysis; DIFFERENCE TIME-DOMAIN; CROSSTALK REDUCTION; MICROSTRIP LINES; SIMULATION; NOISE;

D O I：

10.1109/TEMC.2008.2010054

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present analytical models for line impedance and the coupling coefficient in the presence of additional ground tracks. We use a variational analysis combined with the transverse transmission-line technique to model interconnect lines guarded by ground tracks. Using the proposed model, it would be possible for designers to reduce crosstalk in coupled lines and obtain desired line impedance, thereby ensuring optimum signal integrity. The results obtained are verified by full-wave simulations and measurements performed on a vector network analyzer. The proposed model may find applications in the design and analysis of high-speed interconnects.

引用

页码：67 / 77

页数：11

共 32 条

[1] High-level crosstalk defect simulation methodology for system-on-chip interconnects [J].