Development of a Thermal Camera Using a Low Noise High Speed Far Infrared Camera

被引：0

作者：

Chirila, C. ^{[1
]}

Szolga, L. A. ^{[2
]}

机构：

[1] Univ Nottingham, Elect & Elect Engn, Nottingham, England

[2] Tech Univ Cluj Napoca, Basis Elect, Cluj Napoca, Romania

来源：

2019 IEEE 25TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2019) | 2019年

关键词：

thermal imaging camera; thermopile array; embedded;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the development of a thermal imaging camera using a low noise high speed far infrared sensor from Melexis, MLX90621, and integrating it into an embedded solution alongside a microcontroller from ST Microelectronics with an ARM processor, a 1.8" TFT liquid crystal display and various other peripherals, all powered from a Li-Po battery whose voltage is regulated using a buck-boost converter. The main application of this device is inspecting assembled PCBs for thermal faults, although it can be used for other purposes such as non-contact temperature measurements, automotive thermal comfort system, intrusion detection.

引用

页码：183 / 193

页数：11