Extremely low thermal conductivity and enhanced thermoelectric performance of polycrystalline SnSe by Cu doping

被引：72

作者：

Gong, Yaru ^{[1
]}

Chang, Cheng ^{[2
]}

Wei, Wei ^{[1
]}

Liu, Jiang ^{[1
]}

Xiong, Wenjie ^{[1
]}

Chai, Shuang ^{[1
]}

Li, Di ^{[3
]}

Zhang, Jian ^{[3
]}

Tang, Guodong ^{[1
]}

机构：

[1] Nanjing Univ Sci & Technol, Sch Mat Sci & Engn, MITT Key Lab Adv Metall & Intermetall Mat Technol, Nanjing 210094, Jiangsu, Peoples R China

[2] Beihang Univ, Sch Mat Sci & Engn, Beijing 10091, Peoples R China

[3] Chinese Acad Sci, Inst Solid State Phys, Key Lab Mat Phys, Hefei 230031, Anhui, Peoples R China

来源：

SCRIPTA MATERIALIA | 2018年 / 147卷

基金：

中国国家自然科学基金;

关键词：

Thermoelectric materials; Thermoelectric performance; Thermal conductivity; TRANSPORT-PROPERTIES; HIGH FIGURE; MERIT;

D O I：

10.1016/j.scriptamat.2017.12.035

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Here, we systematically investigated the effect of Cu doping on the thermoelectric properties of SnSe prepared by hydrothermal synthesis. Low Cu doped content (x = 0.01) lead to enhanced electrical conductivity and power factor compared with reported polycrystalline SnSe. Nanoscale precipitates and mesoscale grains define all scale hierarchical architectures to scattering phonons. Furthermore, Cu atomic point-defect scattering play an important role in reducing the lattice thermal conductivity. These two favorable factors lead to low lattice thermal conductivity as low as 0.2 Wm(-1) K-1 at 873 K. This ultralow thermal conductivity results in a ZT of similar to 12 at 873 K in Cuo(0.01)Sn(0.99)Se. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：74 / 78

页数：5

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