Influence of variable thermal conductivity on thermal-plasma-elastic waves of excited microelongated semiconductor

被引:16
|
作者
Ismail, Gamal M. [1 ]
Gepreel, K. A. [2 ]
Lotfy, Kh [3 ,4 ]
Mahdy, A. M. S. [2 ]
El-Bary, A. [5 ]
Saeed, Abdulkafi M. [6 ]
机构
[1] Islamic Univ Madinah, Fac Sci, Dept Math, Madinah 42351, Saudi Arabia
[2] Taif Univ, Dept Math & Stat, Coll Sci, POB 11099, Taif 21944, Saudi Arabia
[3] Zagazig Univ, Fac Sci, Dept Math, POB 44519, Zagazig, Egypt
[4] Taibah Univ, Fac Sci, Dept Math, Madinah, Saudi Arabia
[5] Arab Acad Sci Technol & Maritime Transport, POB 1029, Alexandria, Egypt
[6] Qassim Univ, Coll Sci, Dept Math, POB 6644, Buraydah 51452, Saudi Arabia
关键词
Photo-generated; Optical energy; Microelongation; Thermal conductivity; Thermomechanical waves; Semiconductor; HEAT-SOURCE RESPONSE; PLANE-WAVES; GENERALIZED THERMOELASTICITY; MODEL; EQUATION; FLOW; 2-TEMPERATURE; LIQUID;
D O I
10.1016/j.aej.2022.06.024
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A novel model is formulated of a microelongated semiconductor material. The material is excited in the context of photothermal transport processes. The photo-thermoelasticity theories are applied when the thermal conductivity of the microelongated semiconductor medium is changed. The novel model describes the microelongation case and the interference between the different propagation waves in the elastic medium. Thermal conductivity can be taken as a linear function of temperature during electronic and thermoelastic deformation processes. The dimensionless main fields are taken in a two-dimensional (2D) with maps converter. The harmonic wave method according to the normal mode analysis has been applied to convert the main equations to higher-order ordinary differential equations (ODE). Complete solutions are obtained by applying some conditions that are taken on the semiconductor surface. The results obtained for silicon (Si) are numerically simulated, with illustrations showing this. The comparisons are made and discussed for the main fields during the variable thermal conductivity and microelongation. (C) 2022 THE AUTHORS. Published by Elsevier BV on behalf of Faculty of Engineering, Alexandria University This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:12271 / 12282
页数:12
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