Passivity and Pit Stability Behavior of Copper as a Function of Selected Water Chemistry Variables

被引:38
作者
Cong, Hongbo [1 ]
Michels, Harold T. [2 ]
Scully, John R. [1 ]
机构
[1] Univ Virginia, Dept Mat Sci & Engn, Ctr Electrochem Sci & Engn, Charlottesville, VA 22904 USA
[2] Copper Dev Assoc Inc, New York, NY 10016 USA
关键词
chemical technology; copper; copper alloys; corrosion; electrochemistry; passivation; pipelines; water; water supply; X-RAY PHOTOELECTRON; NEUTRAL TAP WATER; PITTING CORROSION; LOCALIZED CORROSION; ALKALINE-SOLUTIONS; POTABLE WATER; OXIDE-FILMS; BICARBONATE SOLUTIONS; CHLORIDE SOLUTIONS; ION CONCENTRATION;
D O I
10.1149/1.2999351
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The electrochemical pitting behavior of UNS C11000 copper was investigated in a synthetic potable water found to cause pitting. Tests were also conducted in several other HCO3-, SO42-, and Cl- containing waters with systematic variations in concentrations of these species. Studies of the effect of water chemistry on passivity, uniform corrosion, and pitting were accomplished using the cyclic voltammetry method complemented by various diagnostic methods. Certain water chemistry concentrations promote pitting. Critical pitting potentials (E-Pit) for copper pitting are decreased by certain water chemistry variables. High [SO42-]/[OH-], [SO42-]/[HCO3-], and Cl-/[HCO3-] ratios lower pitting potentials while an increase in alkalinity (increasing [OH-] or [HCO3-]/[CO32-]) improves passivity and raises pitting potentials. HCO3-/CO32- can protect copper surfaces by forming carbonate containing minerals. However, carbonated species are less beneficial toward passivity compared to OH- with respect to passivation efficiency. Empirical equations that forecast pitting and repassivation potentials as a function of selected water chemistry variables were developed by linear regression analysis based on experimental pitting and repassivation potential trends with HCO3-, Cl-, and SO42- content. The origins of the trends with water chemistry variables are discussed.
引用
收藏
页码:C16 / C27
页数:12
相关论文
共 78 条
  • [1] *AM SOC TEST MAT I, 2005, STAND TEST METH CHEM
  • [2] [Anonymous], 2003, ADV ELECTROCHEM SCI
  • [3] [Anonymous], 2007, CRC HDB CHEM PHYS
  • [4] [Anonymous], THESIS VIRGINIA POLY
  • [5] An EQMB examination of Cu surface oxides in borate buffer
    Bertocci, U
    [J]. ELECTROCHIMICA ACTA, 2004, 49 (11) : 1831 - 1841
  • [6] Bremer PJ, 2001, J AM WATER WORKS ASS, V93, P82
  • [7] Campbell H.S., 1971, P R EVANS C LOCALIZE, P625
  • [8] CAMPBELL HS, 1950, J I MET, V77, P345
  • [9] X-ray diffraction phase analysis of crystalline copper corrosion products after treatment in different chloride solutions
    Chmielová, M
    Seidlerová, J
    Weiss, Z
    [J]. CORROSION SCIENCE, 2003, 45 (05) : 883 - 889
  • [10] Voltammetric and Raman microspectroscopic studies on artificial copper pits grown in simulated potable water
    Christy, AG
    Lowe, A
    Otieno-Alego, V
    Stoll, M
    Webster, RD
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 2004, 34 (02) : 225 - 233