Sub-THz Micromachined Waveguides for Wafer Level Integration of MMICs

被引：0
|
作者：
Pursula, Pekka [1 ]
Lamminen, Antti [1 ]
Kantanen, Mikko [1 ]
Saarilahti, Jaakko [1 ]
Ermolov, Vladimir [1 ]
机构：
[1] VTT Tech Res Ctr Finland, Espoo, Finland
来源：
2017 12TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC) | 2017年
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.
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页码：321 / 324
页数：4
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