Incidence of atom shuffling on the shear and decohesion behavior of a symmetric tilt grain boundary in copper

被引:74
作者
Sansoz, F [1 ]
Molinari, JF [1 ]
机构
[1] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA
关键词
grain boundary structure; grain boundary cohesion; yield phenomena; simulation; quasicontinuum method;
D O I
10.1016/j.scriptamat.2004.02.031
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The constitutive response of a Sigma9(221) symmetric tilt grain boundary in copper is investigated with an atomistic quasicontinuum method under tension and shear. The maximum strength is found to change with the deformation mode triggered at the interface. Atom shuffling processes cause a major decrease in the intrinsic boundary strength under shear. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1283 / 1288
页数:6
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