Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposite

被引:93
作者
Imai, T
Sawa, F
Ozaki, T
Shimizu, T
Kido, R
Kozako, M
Tanaka, T
机构
[1] Toshiba Co Ltd, Power & Ind Syst R&D Ctr, Fuchu, Tokyo 1838511, Japan
[2] Waseda Univ, Grad Sch Informat Prod & Syst, Wakamatsu Ku, Kitakyushu, Fukuoka 8080135, Japan
关键词
nanocomposite; epoxy resin; nano-filler; mechanical and insulation properties; electrical treeing; internal stress;
D O I
10.1109/TDEI.2006.1624291
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The aim of this study is to investigate the influence of temperature on the mechanical and insulation properties of a newly developed epoxy-layered silicate nanocomposite. This nanocomposite has a higher thermal resistance with respect to mechanical properties than a base epoxy resin (epoxy resin without fillers). The volume resistivity of the nanocomposite gradually decreases with increasing temperature, and its relative permittivity gradually increases with increasing temperature. Its properties are more dependent on temperature than those of the base epoxy resin. Moreover, under a constant ac voltage, the insulation breakdown time of the nanocomposite was twice as long as that of the base epoxy resin at 20 degrees C and six times as long at 80 degrees C. In particular, at 145 degrees C, the nanocomposite had a breakdown time of more than 20,000 minutes while the base epoxy resin had breakdown time of 280 minutes. This improvement in breakdown time resulted from electrical treeing shapes with many branches and smaller internal stress of the nanocomposite in comparison with the base epoxy resin.
引用
收藏
页码:445 / 452
页数:8
相关论文
共 22 条
  • [1] BARTNIKAS R, 1983, ASTM STP, V2, pCH8
  • [2] Thermoset-layered silicate nanocomposites. quaternary ammonium montmorillonite with primary diamine cured epoxies
    Brown, JM
    Curliss, D
    Vaia, RA
    [J]. CHEMISTRY OF MATERIALS, 2000, 12 (11) : 3376 - 3384
  • [3] *COOP CHEM CORP SO, PROD BROCH HOJUN COR
  • [4] Ding HZ, 2004, 2004 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, P332
  • [5] Polymerization compounding: Epoxy-montmorillonite nanocomposites
    Feng, W
    Ait-Kadi, A
    Riedl, B
    [J]. POLYMER ENGINEERING AND SCIENCE, 2002, 42 (09) : 1827 - 1835
  • [6] Introductory remarks on NanoDielectrics
    Fréchette, MF
    Trudeau, M
    Alamdari, HD
    Boily, S
    [J]. 2001 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, 2001, : 92 - 99
  • [7] Increasing the electrical discharge endurance of acid anhydride cured DGEBA epoxy resin by dispersion of nanoparticle silica
    Henk, PO
    Kortsen, TW
    Kvarts, T
    [J]. HIGH PERFORMANCE POLYMERS, 1999, 11 (03) : 281 - 296
  • [8] Imai T, 2004, 2004 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, P402
  • [9] Real time exfoliation behavior of clay layers in epoxy-clay nanocomposites
    Kong, D
    Park, CE
    [J]. CHEMISTRY OF MATERIALS, 2003, 15 (02) : 419 - 424
  • [10] Surface degradation of polyamide nanocomposites caused by partial discharges using IEC(b) electrodes
    Kozako, M
    Fuse, N
    Ohki, Y
    Okamoto, T
    Tanaka, T
    [J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2004, 11 (05) : 833 - 839