A Novel Ultra-Wideband Electromagnetic Bandgap Structure for SSN Suppression

被引:0
作者
Ding, Ping-Ping [1 ]
Chen, Xudong [1 ]
Agarwal, Krishna [1 ]
机构
[1] Natl Univ Singapore, ECE Dept, Singapore 117583, Singapore
来源
2012 IEEE ASIA-PACIFIC CONFERENCE ON ANTENNAS AND PROPAGATION (APCAP) | 2012年
关键词
HIGH-SPEED CIRCUITS; NOISE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel coplanar electromagnetic bandgap (EBG) structure is proposed for efficiently suppressing the simultaneous switching noise in high-speed printed circuit boards and microwave circuits. The unit cells of the EBG structure on the power plane are connected by oblique lines. This modification enhances the performance effectiveness of the EBG structure in terms of high efficiency and the ultra-wide frequency bandwidth of noise suppression. Based on the numerical experiments, it is demonstrated that more than 40 dB reduction in S-parameters can be achieved in an ultra-wide frequency bandwidth up to 12 GHz.
引用
收藏
页码:168 / 169
页数:2
相关论文
共 6 条
[1]   Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits [J].
Abhari, R ;
Eleftheriades, GV .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (06) :1629-1639
[2]   Ultra-wideband mitigation of simultaneous switching noise using novel planar electromagnetic bandgap structures [J].
Qin, Jie ;
Ramahi, Omar M. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2006, 16 (09) :487-489
[3]   High-impedance electromagnetic surfaces with a forbidden frequency band [J].
Sievenpiper, D ;
Zhang, LJ ;
Broas, RFJ ;
Alexópolous, NG ;
Yablonovitch, E .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999, 47 (11) :2059-2074
[4]   A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures [J].
Wu, TL ;
Lin, YH ;
Chen, ST .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2004, 14 (07) :337-339
[5]   An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits [J].
Wu, Tzong-Lin ;
Chen, Sin-Ting .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2006, 16 (07) :413-415
[6]   Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation [J].
Wu, Tzong-Lin ;
Chuang, Hao-Hsiang ;
Wang, Ting-Kuang .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (02) :346-356