Influence of depth in helium desorption from cavities induced by 3He implantation in silicon

被引:1
作者
Delamare, R
Ntsoenzok, E
Labohm, F
van Veen, A
机构
[1] CNRS, Ctr Etud & Rech Irradiat, FR-45071 Orleans, France
[2] Delft Univ Technol, Interfac Reactor Inst, NL-2629 JB Delft, Netherlands
来源
GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY | 2002年 / 82-84卷
关键词
cavities; desorption; helium; implantation; silicon;
D O I
10.4028/www.scientific.net/SSP.82-84.303
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We implanted silicon at different depth with He-3. We used 1.55 MeV helium implantation and aluminum foils in order to obtain implanted depths ranging from 1.1 to 5.6 mum as simulated by TRIM. All these implantation were done with a dose of 5x10(16) He/cm(2). This dose is higher enough to create cavities for all cases studied. The study showed that the desorption speed decreases with the implantation depth. The classical model of helium desorption can no longer be applied. New approaches were developed for the desorption of helium from deeper implantation. In addition, as expected, the activation energy of the desorption is not depth dependent.
引用
收藏
页码:303 / 307
页数:5
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