An Inductive-Coupling Interconnected Application-Specific 3D NoC Design

被引：0

作者：

Zhang, Zhen ^{[1
]}

Yin, Shouyi ^{[1
]}

Liu, Leibo ^{[1
]}

Wei, Shaojun ^{[1
]}

机构：

[1] Tsinghua Univ, Inst Microelect, Beijing, Peoples R China

来源：

IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES | 2013年 / E96A卷 / 12期

关键词：

Networks-on-Chip (NoC); 3D chip; inductive-coupling interconnection; design automation; NETWORKS;

D O I：

10.1587/transfun.E96.A.2633

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

TSV-interconnected 3D chips face problems such as high cost, low yield and large power dissipation. We propose a wireless 3D on-chip-network architecture for application-specific SoC design, using inductive-coupling interconnect instead of TSV for inter-layer communication. Primary design challenge of inductive-coupling 3D SoC is allocating wireless links in the 3D on-chip network effectively. We develop a design flow fully exploiting the design space brought by wireless links while providing flexible tradeoff for user's choice. Experimental results show that our design brings great improvement over uniform design and Sunfloor algorithm on latency (5% to 20%) and power consumption (10% to 45%).

引用

页码：2633 / 2644

页数：12