Two phase cooling with heat transfer enhancement for BGA package

被引：0

作者：

Khan, Navas ^{[1
]}

Toh, K. C. ^{[2
]}

Kripesh, V. ^{[1
]}

Yoon, Seung Wook ^{[1
]}

机构：

[1] Inst Microelect, 11 Sci Pk Rd, Singapore, Singapore

[2] Nanyang Technol Univ, Singapore, Singapore

来源：

2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3 | 2008年

关键词：

pool boiling enhancement; boiling heat transfer; critical heat flux; passive cooling;

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel width, channel pitch on heat transfer enhancement has been investigated. Maximum of 300% higher heat flux is demonstrated with the enhancement structure. A compact two phase cooling solution for a BGA flip-chip package is developed and characterized. The enhancement structure is integrated with the two-phase cooling solution and its performance is reported.

引用

页码：79 / +

页数：2

共 11 条

[1] Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness
Honda, H
Takamastu, H
Wei, JJ
[J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2002, 124 (02): : 383 - 390
[2] HSU YY, 1962, ASME J HEAT TRANSFER, V84, P207
[3] Pool boiling heat transfer enhancement by surface modification/micro structures for electronics cooling: A review
Khan, N
Pinjala, D
Toh, KC
[J]. 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 273 - 280
[4] Assessment of high-heat-flux thermal management schemes
Mudawar, I
[J]. ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, : 1 - 20
[5] Permanence and global attractivity for facultative mutualism system with delay
Mukherjee, D
[J]. MATHEMATICAL METHODS IN THE APPLIED SCIENCES, 2003, 26 (01) : 1 - 9
[6] EFFECTS OF PORE DIAMETERS AND SYSTEM PRESSURE ON SATURATED POOL NUCLEATE BOILING HEAT-TRANSFER FROM POROUS SURFACES
NAKAYAMA, W
DAIKOKU, T
NAKAJIMA, T
[J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1982, 104 (02): : 286 - 291
[7] A DIELECTRIC SURFACE COATING TECHNIQUE TO ENHANCE BOILING HEAT-TRANSFER FROM HIGH-POWER MICROELECTRONICS
OCONNOR, JP
YOU, SM
PRICE, DC
[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (03): : 656 - 663
[8] Tan L, 2004, CHINESE PHYS, V13, P1005
[9] Boiling heat transfer enhancement by submerged, vibration induced jets
Tillery, SW
Heffington, S
Smith, MK
Glezer, A
[J]. ITHERM 2004, VOL 2, 2004, : 17 - 22
[10] Zuber N., 1958, T AM SOC MECH ENG, V80, P711

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