One-step multicomponent encapsulation by compound-fluidic electrospray

Fabrication of sophisticated or smart materials often needs controlled integrating multiple components into a single capsule. Most of conventional microencapsulation strategies merely envelop one content into a shell every time. We report a compound-fluidic electrospray method could one-step enclose multiple components into a single microcapsule without contact. The as-prepared microcapsules have multiple compartments inside, in each of which different content can be addressably loaded. This approach gives flexibility for generating diverse microcapsules that could one-step integrate different active components in microscopic domain free of contact, which may find potential applications in multicomponent drug delivery, microreactors and others.