In-depth analysis of InAlN/GaN HEMT heterostructure after annealing using angle-resolved X-ray photoelectron spectroscopy

被引:3
作者
Bourlier, Yoan [1 ]
Bouttemy, Muriel [1 ]
Fregnaux, Mathieu [1 ]
Patard, Olivier [2 ]
Gamarra, Piero [2 ]
Piotrowicz, Stephane [2 ]
Delage, Sylvain [2 ]
Etcheberry, Arnaud [1 ]
机构
[1] Univ Paris Saclay, Univ Versailles St Quentin Yvelines, CNRS, Inst Lavoisier Versailles ILV, 45 Ave Etats Unis, F-78035 Versailles, France
[2] III V Lab, Microelect GaN, Campus Polytech, Palaiseau, France
关键词
MEAN FREE PATHS; LAYERS; SURFACES; XPS;
D O I
10.1002/sia.6857
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
During high-electron-mobility transistor elaboration process, a thermal treatment of In0.2Al0.8N (InAlN) barrier layer is performed in order to improve electrical performances. We showed previously that In0.2Al0.8N/GaN heterostructures, annealed at 850 degrees C under O(2)partial pressure, present a specific in-depth organization. Angle-resolved X-ray photoelectron spectroscopy is a powerful tool to precisely determine the spatial localization and relative position of the different interfaces, from InAlN until buried GaN layer. The proposed in-depth model of the stack evidences (1) an Al-rich surface oxide with embedded N(2)molecules, (2) an interlayer of InAlN(<1)governed by nitrogen lattice defects, (3) a stable In0.2Al0.8N matrix, and finally (4) the GaN buffer layer underneath.
引用
收藏
页码:914 / 918
页数:5
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