Multi-physics modelling of a vapour phase soldering (VPS) system

被引：33

作者：

Illes, Balazs ^{[1
]}

Geczy, Attila ^{[1
]}

机构：

[1] Budapest Univ Technol & Econ, Dept Elect Technol, H-1111 Budapest, Hungary

来源：

APPLIED THERMAL ENGINEERING | 2012年 / 48卷

关键词：

VPS; Vapour phase soldering; Multi-physics modelling; Evaporation; Galden;

D O I：

10.1016/j.applthermaleng.2012.04.053

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper presents a novel multi-physics modelling approach of the Vapour Phase Soldering (VPS) process. The model applies combined transport mechanisms including heat transport by heat conduction; mass transport by diffusion in the fluids and by phase change during the evaporation and condensation of the Galden liquid; and energy transport caused by mass transport. The model can describe the temperature and vapour concentration relations in the oven - which are the main parameters of the vapour phase soldering process - from the start of the Galden evaporation until the saturation of the vapour space (prepared for soldering). The results calculated by the model show proper conformation with the experimental results of temperature and pressure measurements. The model was tested on a batch type VPS system where the position of the processing volume was optimized in the soldering tank. With the information obtained from the model the whole VPS process can be investigated. (c) 2012 Elsevier Ltd. All rights reserved.

引用

页码：54 / 62

页数：9

共 24 条

[1] Novel perfluoropolyethers containing 2,2,4-trifluoro-5-trifluoromethoxy-1,3-dioxole blocks: synthesis and characterization [J].

Avataneo, M. ;

Navarrini, W. ;

De Patto, U. ;

Marchionni, G. .

JOURNAL OF FLUORINE CHEMISTRY, 2009, 130 (10) :933-937

[2] Estimation of the vapor pressure of PFPEs by TGA [J].

Bassi, Mattia .

THERMOCHIMICA ACTA, 2011, 521 (1-2) :197-201

[3] Numerical simulation of periodic mixed convective heat transfer in a rectangular cavity with a vibrating lid [J].

Chen, Chin-Lung ;

Cheng, Chin-Hsiang .

APPLIED THERMAL ENGINEERING, 2009, 29 (14-15) :2855-2862

[4] Studies on thermal properties and thermal control effectiveness of a new shape-stabilized phase change material with high thermal conductivity [J].

Cheng, Wen-long ;

Liu, Na ;

Wu, Wan-fan .

APPLIED THERMAL ENGINEERING, 2012, 36 :345-352

[5]

Duck A., 2010, P INT C SOLD REL TOR, P2

[6] A simplified model for analysis of heat and mass transfer in a direct evaporative cooler [J].

Fouda, A. ;

Melikyan, Z. .

APPLIED THERMAL ENGINEERING, 2011, 31 (05) :932-936

[7]

Freedman G. M., 2008, PRINTED CIRCUITS HDB

[8] Investigations on vapor phase soldering process in an experimental soldering station [J].

Géczy A. ;

Illyefalvi-Vitéz Z. ;

Szoke P. .

Micro and Nanosystems, 2010, 2 (03) :170-177

[9] Application of optimization techniques and the enthalpy method to solve a 3D-inverse problem during a TIG welding process [J].

Goncalves, Cristiene Vasconcelos ;

Carvalho, Solidonio Rodrigues ;

Guimaraes, Gilmar .

APPLIED THERMAL ENGINEERING, 2010, 30 (16) :2396-2402

[10] Effect of solder reflow temperature profile on plastic package delamination [J].

Huang, YE ;

Hagen, D ;

Dody, G ;

Burnette, T .

TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, :105-111

← 1 2 3 →