Microstructure and Growth Behavior of the Intermetallic Compound for Sn-1.0Ag-0.5Cu-NiB/Cu Solder Joint Interface

被引：2
作者：
Qu, Junfeng
Xu, Jun
Hu, Qiang
Zhang, Fuwen
机构：
来源：
ADVANCES IN MATERIALS AND MATERIALS PROCESSING, PTS 1-3 | 2013年 / 652-654卷
关键词：
Leader-free solder; Interfacial reaction; B addition; Intermetallic compound; Sn-1.0Ag-0.5Cu-NiB; PB-FREE SOLDERS; CU SUBSTRATE; KINETICS;
D O I：
10.4028/www.scientific.net/AMR.652-654.1106
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This research investigates the microstructure and growth behavior of the intermetallic compound(IMC) of Sn-1.0Ag-0.5Cu, Sn-1.0Ag-0.5Cu-0.05Ni and Sn-1.0Ag-0.5Cu-0.05N-0.02B/Cu solder joint interface. The interfacial reactions between Cu and the solders at 250 +/- 1 degrees C were examined. Experimental results indicated that the IMCs of the above alloy systems on the soldering interface were Cu6Sn5 and (Cu-x, Ni1-x)(6)Sn-5, respectively. The grain size of primary Sn decreased observably with the micro addition of B and a large number of fine reinforcement particles were found in the solder. With the aging time increasing, the (Cu-x, Ni1-x)(6)Sn-5 micrograph of the Sn-1.0Ag-0.5Cu-0.05N-0.02B solder joint interface was changed from sawtooth-like to shape-layer, but the thickness of IMCs increased unobservably.
引用
收藏
页码：1106 / 1110
页数：5
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