Effect of growth temperature on the epitaxy strain relaxation and the tilt of InxAl1-xAs graded layer grown by solid-source molecular beam epitaxy

被引:6
作者
Loke, Wan Khai [1 ]
Tan, Kian Hua [1 ]
Wicaksono, Satrio [1 ]
Yoon, Soon Fatt [1 ]
Owen, Man Hon Samuel [2 ]
Yeo, Yee-Chia [2 ]
机构
[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
[2] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore
基金
新加坡国家研究基金会;
关键词
Growth temperature - III-V semiconductors - Indium phosphide - Molecular beams - High resolution transmission electron microscopy - Molecular beam epitaxy - Semiconducting indium phosphide - Grading;
D O I
10.1088/0022-3727/45/50/505106
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this study, we investigate the effect of the molecular beam epitaxial growth temperature on the epilayer tilt and the strain relaxation in the InAlAs M-buffer layer when the In composition is varied linearly from 6 to 57% followed by an inverse grading to 52% where InAlAs is lattice-matched to InP. The samples grown at 420 and 500 degrees C have final epilayer tilts of 0.66-0.68 degrees about the [1 (1) over bar0] axis towards [(1) over bar(1) over bar0], whereas the sample grown at 370 degrees C has a smaller tilt of 0.15 degrees about the [1 (1) over bar0] axis but towards [110]. Cross-sectional transmission electron microscopy micrographs showed that the sample grown at 420 degrees C has the lowest dislocation density (6 x 10(6) cm(-2)) compared with those grown at 370 and 500 degrees C. The inversely graded layer in all samples was shown to be effective in reducing the strain that was accumulated during the forward graded layer. This resulted in close to fully relaxed epilayers (92-99%), which are necessary for the prevention of further occurrence of dislocation nucleation (an important criterion for subsequent device structure growth).
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页数:9
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