AlGaN/GaN high electron mobility transistors with InGaN back-barriers

被引:301
|
作者
Palacios, T [1 ]
Chakraborty, A [1 ]
Heikman, S [1 ]
Keller, S [1 ]
DenBaars, SP [1 ]
Mishra, UK [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
gallium nitride; high-electron mobility transistor (HEMT); high-frequency performance; indium gallium nitride; mm-wave devices; polarization; short-channel effects;
D O I
10.1109/LED.2005.860882
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A GaN/ultrathin InGaN/GaN heterojunction has been used to provide a back-barrier to the electrons in an AlGaN/GaN high-electron mobility transistor (HEMT). The polarization-induced electric fields in the InGaN layer raise the conduction band in the GaN buffer with respect to the GaN channel, increasing the confinement of the two-dimensional electron gas under high electric field conditions. The enhanced confinement is especially useful in deep-submicrometer devices where an important improvement in the pinchoff and 50% increase in the output resistance have been observed. These devices also showed excellent high-frequency performance, with a current gain cut-off frequency (f(T)) of 153 GHz and power gain cut-off frequency (f(max)) of 198 GHz for a gate length of 100 nm. At a different bias, a record f(max) of 230 GHz was obtained.
引用
收藏
页码:13 / 15
页数:3
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